JPS6347341B2 - - Google Patents
Info
- Publication number
- JPS6347341B2 JPS6347341B2 JP58119403A JP11940383A JPS6347341B2 JP S6347341 B2 JPS6347341 B2 JP S6347341B2 JP 58119403 A JP58119403 A JP 58119403A JP 11940383 A JP11940383 A JP 11940383A JP S6347341 B2 JPS6347341 B2 JP S6347341B2
- Authority
- JP
- Japan
- Prior art keywords
- diode
- electrode
- diameter
- glass
- end diameter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
- H01L23/08—Containers; Seals characterised by the material of the container or its electrical properties the material being an electrical insulator, e.g. glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/492—Bases or plates or solder therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11940383A JPS6010760A (ja) | 1983-06-30 | 1983-06-30 | ダイオ−ド電極部品 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11940383A JPS6010760A (ja) | 1983-06-30 | 1983-06-30 | ダイオ−ド電極部品 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6010760A JPS6010760A (ja) | 1985-01-19 |
JPS6347341B2 true JPS6347341B2 (en]) | 1988-09-21 |
Family
ID=14760618
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11940383A Granted JPS6010760A (ja) | 1983-06-30 | 1983-06-30 | ダイオ−ド電極部品 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6010760A (en]) |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6050340B2 (ja) * | 1980-02-26 | 1985-11-08 | ソニー株式会社 | 半導体素子 |
-
1983
- 1983-06-30 JP JP11940383A patent/JPS6010760A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS6010760A (ja) | 1985-01-19 |
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